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Slowing down the heat in thermoelectrics - Qin - 2021 - InfoMat - Wiley  Online Library
Slowing down the heat in thermoelectrics - Qin - 2021 - InfoMat - Wiley Online Library

High‐Performance Dielectric Ceramic Films for Energy Storage Capacitors:  Progress and Outlook - Palneedi - 2018 - Advanced Functional Materials -  Wiley Online Library
High‐Performance Dielectric Ceramic Films for Energy Storage Capacitors: Progress and Outlook - Palneedi - 2018 - Advanced Functional Materials - Wiley Online Library

Low-k dielectric materials - ScienceDirect
Low-k dielectric materials - ScienceDirect

Electronics | Free Full-Text | Recent Trends in Copper Metallization
Electronics | Free Full-Text | Recent Trends in Copper Metallization

10 Lowk
10 Lowk

Batteries | Free Full-Text | Carbon-Based Materials for Supercapacitors:  Recent Progress, Challenges and Barriers
Batteries | Free Full-Text | Carbon-Based Materials for Supercapacitors: Recent Progress, Challenges and Barriers

Low Dielectric Constant Materials | Chemical Reviews
Low Dielectric Constant Materials | Chemical Reviews

Integration of Low-/r Dielectric Materials Into Sub-0.25-yum Interconnects
Integration of Low-/r Dielectric Materials Into Sub-0.25-yum Interconnects

Low Dielectric Materials for Microelectronics | IntechOpen
Low Dielectric Materials for Microelectronics | IntechOpen

Dielectric Constant - an overview | ScienceDirect Topics
Dielectric Constant - an overview | ScienceDirect Topics

Low Dielectric Constant Materials | Chemical Reviews
Low Dielectric Constant Materials | Chemical Reviews

MRS volume 22 issue 10 Cover and Front matter | MRS Bulletin | Cambridge  Core
MRS volume 22 issue 10 Cover and Front matter | MRS Bulletin | Cambridge Core

Chemically Tunable Organic Dielectric Layer on an Oxide TFT:  Poly(p-xylylene) Derivatives | ACS Applied Materials & Interfaces
Chemically Tunable Organic Dielectric Layer on an Oxide TFT: Poly(p-xylylene) Derivatives | ACS Applied Materials & Interfaces

PDF) Challenges in the implementation of low-k dielectrics in the back-end  of line
PDF) Challenges in the implementation of low-k dielectrics in the back-end of line

Dissipation Factor of Plastic Materials Explained
Dissipation Factor of Plastic Materials Explained

Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k  dielectrics | Nature Communications
Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics | Nature Communications

Linear Relationship between the Dielectric Constant and Band Gap in Low-Dimensional  Mixed-Halide Perovskites | The Journal of Physical Chemistry C
Linear Relationship between the Dielectric Constant and Band Gap in Low-Dimensional Mixed-Halide Perovskites | The Journal of Physical Chemistry C

Low Dielectric Materials for Microelectronics | IntechOpen
Low Dielectric Materials for Microelectronics | IntechOpen

Exploring Strategies for High Dielectric Constant and Low Loss Polymer  Dielectrics | The Journal of Physical Chemistry Letters
Exploring Strategies for High Dielectric Constant and Low Loss Polymer Dielectrics | The Journal of Physical Chemistry Letters

10 Lowk
10 Lowk

Materials | Free Full-Text | Recent Advances in Barrier Layer of Cu  Interconnects
Materials | Free Full-Text | Recent Advances in Barrier Layer of Cu Interconnects

Integration of Low-/r Dielectric Materials Into Sub-0.25-yum Interconnects
Integration of Low-/r Dielectric Materials Into Sub-0.25-yum Interconnects

PDF) Challenges in the implementation of low-k dielectrics in the back-end  of line
PDF) Challenges in the implementation of low-k dielectrics in the back-end of line

PDF) Challenges in the implementation of low-k dielectrics in the back-end  of line
PDF) Challenges in the implementation of low-k dielectrics in the back-end of line

Electrode and electrolyte configurations for low frequency motion energy  harvesting based on reverse electrowetting | Scientific Reports
Electrode and electrolyte configurations for low frequency motion energy harvesting based on reverse electrowetting | Scientific Reports

Integration of low k spin-on polymer (SOP) using electron beam cure for  non-etch-back application
Integration of low k spin-on polymer (SOP) using electron beam cure for non-etch-back application